|
BP22S-MJ
The BP20C-S/BP22S-MJ can handle substrates/carriers
of BGA(ø 0.6mm ~ ø 1.0mm) and CSP(ø
0.5mm ~ ø 0.3mm)
|
Versatile line-up to choose
from according to your needs from BGA to CSP
Highly
reliable solder ball placement
The optimum programming and soldering system actualizes
stable, high-accuracy solder ball placement.
Versatility
These versatile machines place solder balls on srtip-shaped
substrate (BP20, BP22) or individual substrates on a
carrier (BP22). Individual placement and gang placement
can also be done with these machines.
Real-time
production control information system
The colour monitor not only displays information on
ongoing production, but gives feedback while analyzing
past production data, resulting in higher productivity.
Optional
Stable production is ensured by using such options as
automatic flux supply unit, solder ball recognition
system or substrate cleaning unit.
Specifications
| Model |
BP20C-S |
BP22S-MJ |
| Model
No. |
KXF-336A |
KXF-346A |
| Application
substrate |
Strip-shaped substrate
for CSP/BGA |
Strip-shaped substrate
for BGA, substrate on a carrier |
| Cycle
Time |
14s/cycle (transfer time,
recognition time included) |
10s/cycle (transfer time,
recognition time included) |
| Placement
Accuracy |
±60
µm |
| Substrate
Size |
L 1mm X W 30mm ~ L 260mm
X W 70mm
(gang placement area ~ L 125mm X w 60mm) |
L 001mm X W 50mm ~ L 330mm
X W 250mm
(gang placement area ~ L 310mm X w 60mm) |
| Solder
Ball Pitch |
0.5mm ~ 1.5mm |
1mm ~ 1.5mm |
Solder
Ball Diameter
Applicable Substrate |
ø 0.3 ~ ø
1.0mm
(up to 3000 balls) |
ø 0.6 ~ ø
1.0mm [optional :ø 0.3mm]
(up to 5000 balls) |
| Power
Supply |
Three phase
AC 200 V ±10V, 6KVa |
| Air
Supply |
440kPa, 50l/min [standard] |
|
| Dimensions |
L 1000mm X D 1200 mm X
H 1700mm |
L 1220mm X D 1480 mm X
H 1700mm |
| Mass |
1000kg |
1200kg |
*Value such as cycle time, placement
accuracy may vary depending on operational conditions.
|
