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PC30B-HS and PC32P-MS improve
the bondability onto a gold plated electrode by original
nickel removing process. Thus a cheap gold plating can
be used and eventually costs will be cut sharply. And
also the oxygen plasma suitable for the improvement
o fthe resin adhesion is supported.
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Substantial reductions in
substrate costs contribute to customers' profits
The
reason why an extra-thin gold plated electrode can be
used
When a extra-thin gold plated electrode is used, nickel
compunds are formed on a surface after the heat treament
by the die-bonding cure. These nickel compunds impair
the wire bonding performance, thus it is said that a
thin gold plated electrode is unsuitable for wire bonding.
However, the argon plasma treatment eliminates the nickel
conpunds, therefore stable wire bonding can be performed
on an extra-thin and extra cheap gold pated electrode.
Surface reforming
by oxygen plasma
Surface reforming by oxygen
radical improves nold resin adhesion and under-fill
wettability. [optional]
Specifications
| Model |
PC30B-HS |
PC32P-MS |
| Model
No. |
KXF-919D |
KXF-907D |
| Cycle
Time |
15s/substrate (30s/2 substrate) |
45s/substrate
(30s/substrate for less than 150mm substrate in
length) |
| Substrate
Size |
L 50mm X W 20mm ~ L 250mm
X W 70mm |
L 50mm X W 20mm ~ L 330mm
X W 160mm |
| Substrate
Thickness |
0.07mm ~ 2.0mm |
0.5mm ~ 2.0mm |
| Cleaning
Method |
RF parallel
electrode type |
| Gas
for Electrical Discharge |
Ar [optional
: 02] |
| Transfer
Type |
Two-fold buffer cassette |
Two-fold buffer cassette
changer |
| Application
Substrate |
BGA, CSP substrate |
COB substrate |
| Power
Supply |
Single phase
AC 200V ± 10V, 4 kVa |
| Air
and Gas Supply |
Air: 440kPa,
6.5 l/min Gas: Gas cylinder |
| Dimensions |
L 1500mm X D 800 mm X
H 1600mm |
L 1770mm X D 800 mm X
H 1600mm |
| Mass |
550kg |
650kg |
*Value such as cycle time, may
vary depending on operational conditions.
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