For DM60M-H, the stamping and
dispensing methods can be selected, siz types[optional:
eight types] of die can be combined, wafers and trays
can be shared, and so on. It support every type of substrate
and realizes high-efficiency production with high-speed
bonding by dividing processes. |
The DM60, the leading model
of COB die bonders
High-efficiency
production
The eight- nozzle automatic switching method is used
for the bonding head, and up to eight different dies
can be bonded at a time without exchanges, which realizes
efficient production.
Flexible
production
This versatile machine accepts virtually any type of
substrate - such as strip-shaped substrates, long substrates,
individual substrates on a carrier, or flexible substrates.
High-quality
production
The damage-free die pick-up, the digitally-controlled
loading, and the scrub function to improve resin wettability
all contribute to high-quality production.
Specifications
| Model |
DM60M-H |
| Model
No. |
KXF-393D |
| Cycle
Time |
0.8s/cycle (dry cycle) |
| Placement
Accuracy |
± 50µm [optional:
± 10µm, when placed with correction
through recognition] |
| Substrate
Size |
L 50mm X W 15mm ~ L 310mm
X W 140mm (~L 310mm X W 90mm, when placed with correction
through recognition) |
| Die
Size |
L 0.9mm X W 0.9mm ~ L
12.0mm X W 12.0mm [optional: contact us] |
| Die
Type |
Max. 6 types [optional:
8 types] |
| Die
Feeding Method |
Max. 8inch wafer/tray |
| Power
Supply |
Three phase AC 200 V ±10V,
5.2KVa |
| Air
Supply |
440kPa, 50 l/min [standard] |
| Dimensions |
L 1800mm X D 1650 mm X
H 1520mm |
| Mass |
1500kg |
*Value such as cycle time, placement
accuracy may vary depending on operational conditions.
|
