The DA46L-H can handle a wide
variety of packages from QFP to BGA and CSP stacked packages.
This high-speed, high accuracy die bonder has a cycle
time of 0.35s/die. The pre-bonding/post-bonding inspection
functions ensure stable, high quality production. |
High-quality production
supports bonding of not only BGA and CSP but also next-generation
packages
Most
suitable for bonding of stacked packages
- The epoxy writing function supports the uniform
fixed-quantity of resin by choosing the most suitable
writing pattern to dies of various forms, such as
large-sized and rectangular. And the pre- and post-bonding
inspection function realizes high-quality and stable
bonding.
- High-reliability grip-feed method is adopted for
substrate transfer, thus even a thin substrate can
be transferred with reliability. Bonding onto a matrix-layout
substrate is flexibly supported because the pitch
can be set digitally.
- The damage-free die pick-up system can handle the
bonding of thin dies and dies with adhesive tape.
[optional]
High
Productivity
- This machine realizes the high productivity of 4500UPH
and efficient die pick-up by its wafer-mapping function.
- The productivity per area can be improved because
of its compact body supported to eight-inch wafers.
- The one-touch exchange performs a unit replacement
in no more than ten minutes, and exchange procedures
have been radically reduced.
Specifications
| Model |
DH46L-H-M |
| Model
No. |
KXF-392A |
| Cycle
Time |
0.35s/cycle (dry cycle) |
| Bonding
Accuracy |
XY: ± 30µm,
Ø: ± 0.5° |
| Substrate
Size |
L 100mm X W 20mm ~ L 265mm
X W 70mm |
| Die
Size |
L 0.8mm X W 0.8mm ~ L
25.0mm X W 25.0mm |
| Die
Feeding Method |
Max. 8 inch wafer |
| Epoxy
Writing Method |
Dispensing |
| Power
Supply |
Single phase AC 200 V
±10V, 4KVa |
| Air
Supply |
440kPa, 20 l/min [standard] |
| Dimensions |
L 1360mm X D 1080 mm X
H 1700mm (loader not included) |
| Mass |
1250kg (loader not included) |
*Value such as cycle time, bonding
accuracy may vary depending on operational conditions.
|
