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FB30T-M
FB35W-M
FB30T-M is the semi-automatic flip chip bonder for development,
and FB35W-M is the full-automatic-type flip chip bonder
for mass production. Both the machines support the various
processses of such as C4, conductive resin, and ACF
by controlling the press and heating conditions precisely,
and realize high-accuracy bonding by high-rigid equipment
structure.
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Supporting various flip
chip process such as C4, conductive resin and ACF, etc.
Capable
of handling any flip-chip process
Every flip chip process is supported by exchanging units
Specifications
| Model |
FB50W-M |
FB35W-M |
| Model
No. |
KXF-3A3D |
KXF-343D |
| Cycle
Time |
9s/die
(processing time not included) |
5s/die
(processing time not included) |
| Bonding
Accuracy |
± 15µm |
| Substrate
Size |
L 50mm X W
25mm ~ L 300mm X W 150mm |
| Die
Size |
L 1mm X W
1mm ~ L 25mm X W 25mm |
| Die
Feeding Method |
Tray (2 inch, 4 inch) |
Max. 8 inch wafer/tray |
| Bonding
Load |
1.5N ~ 490N
[optional: 0.2N ~ 7.9N] |
| Thermal
Type |
Die: Constant
heating (Max. 350 °C) or ceramic heating (max.
500 °C)
Substrate: Constant heating (Max 150°C) |
| Power
Supply |
Three phase
AC 200 V ±10V, 4KVa |
| Air
Supply |
490kPa, 120 l/min [standard] |
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| Dimensions |
L 1100mm X D 1150 mm X
H 1520mm |
L 1400mm X D 1770 mm X
H 1520mm |
| Mass |
1200kg |
1700kg |
*Value such as cycle time, bonding
accuracy may vary depending on operational conditions.
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