The FB50W-M is as ultrasonic flip-chip
bonder for crystal and SAW devices. The linear-motor bonding
head realizes high-speed bonding at the rate of 1.4s/die. |
Most suitable for mass production
of small-sized electronic parts such as crystal devices
and SAW devices
High-speed,
ultrasonic bonding
Ultrasonic bonding of gold and gold realizes high-speed
and high-reliability at the rate of 1.4s/die.
Specifications
| Model |
FB50W-M |
| Model
No. |
KXF-354D |
| Cycle
Time |
1.4s/die (bonding time
not included) |
| Bonding
Accuracy |
± 15µm |
| Substrate
Size |
L 50mm X W 25mm ~ L 300mm
X W 150mm |
| Die
Size |
L 0.5mm X W 0.5mm ~ L
5.0mm X W 5.0mm |
| Die
Feeding Method |
Max. 6 inch wafer [optional:
2 inch, 4 inch tray] |
| Bonding
Load |
2.9N ~ 19.6N |
| Thermal
Type |
Die: ---------------------
Substrate: Constant heating (Max 200 °C) |
| Power
Supply |
Single phase AC 200 V
±10V, 3 KVa |
| Air
Supply |
440kPa, 80 l/min [standard] |
| Dimensions |
L 1300mm X D 1100 mm X
H 1700mm |
| Mass |
1400kg |
*Value such as cycle time, bonding
accuracy may vary depending on operational conditions.
|
