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TB33C-ST
TB35C-MT
TB33C-ST bonds the chip for
driver onto the small- and middle-sized LCDS with high-efficiency.
TB35C-MT does onto the large-sized ones with high-efficiency.
Both the machines are designed to save space based on
the all-in-one method, thus the ACF attachment, chip
pre-bonding and final-bonding processes are carried
out on a single body. Not only COG, COF, FOG construction
methods but also TCP construction method can be supported
by exchanging units.
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All-in-one method realizes
high-speed, high accuracy, and high-quality FPD assembly
High-productivity
This machine realizes high-productivity
by dividing the bonding processes into the three processes.
Above all, the final-bondong process has two stations,
thus the time for final bonding is reduced by half to
keep a tact balance with each process. In addition,
the rotary head is adopted for the transfer process
for IC and TCP, and the four-arm simultaneous transfer
mechanism is adopted for the panel transfer between
processes, realizing high productivity.
Specifications
| Model |
TB33C-ST |
TB35C-MT |
| Model
No. |
KXF-315T |
KXF-375T |
| Process |
ACF attachment |
Chip/TCP pre-bonding |
Chip/TCP final bonding |
ACF attachment |
Chip/TCP pre-bonding |
Chip/TCP final bonding |
| Bonding
Side |
6s/panel
*cycle time per panel when two one-chip-bonding
are transferred at a time |
3.8s/ACF
(pressing time 1.5s) |
3.5s/ACF
(pressing time 0.5s) |
7.5s/ACF
(pressing time 5s) |
| Cycle
Time |
±60
µm |
| Bonding
Accuracy |
X: ±300 µm
Y: ±200 µm |
----NA---- |
X: ±8µm
Y: ±8µm |
X: ±300 µm
Y: ±200 µm |
----NA---- |
X: ±8µm
Y: ±8µm |
| Panel
Size |
L 25 mm X
W 20mm ~ L 200mm X W 150mm |
L 165mm X
W 130mm ~ L 400mm X W 300mm |
Chip
Size
(TCP Size)
|
L 4mm X W
1mm ~ L 20mm X W 5mm
(L 15mm X W 5mm ~ L 61mm X W 50mm) |
| ACf
Size |
W 1.5mm ~
6.0mm [optional: ~ 11.0mm], Reel diameter: Max.
ø 150mm |
| Feeding
Method |
Cassette
(2/3 layered tape) |
Chip-on-tray(2 3, 4 inch)
TCP tray |
----NA---- |
Cassette
(2/3 layered tape) |
Chip-on-tray(2 3, 4 inch)
TCP tray |
----NA---- |
| Press
Method / Temperature Max. Pressure |
Max.120°C
150N/ACF |
Max.100°C
20N/Chip(TCP) |
Max.350°C
200N/ACF |
Max.120°C
150N/ACF |
Max.120°C
10N/Chip(TCP) |
Max.350°C
200N/Chip(TCP) |
| Pwer
Supply |
Three phase
AC 200 V ±10V, 6KVa |
| Air
Supply |
490kPa, 170l/min
[standard] |
490kPa, 300l/min
[standard] |
| Dimensions |
L 2405mm X
D 1550 mm X H 1700mm |
L 2500mm X
D 1650 mm X H 1700mm |
| Mass |
2200kg |
2500kg |
*Value such as cycle time, placement
accuracy may vary depending on operational conditions.
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