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High-speed,
high-accuracy, stable dispensing achieved due to simple
triple-head construction.
BD30S-M High-speed adhesive dispenser applies
the adhesive for temporarily securing the chip parts,
and it uses a dispenser system for this purpose.
High-speed dispensing at 0.06s per dot is achieved through
the use of one drive system for the heads and another
drive system for the PCBs and the optimized design of
the air piping system. The dispensing parameter library
function makes the machine much easier to operate.
Features
- Feedback of the dispensing quantity.
- Head stroke & ascent-descent
velocity changeable function.
- Temperature control.
- Dispensing control based on the
high-speed dispense process theory.
- One-touch syringe exchange.
Specifications
| Model |
BD30S-M |
| Model
No. |
KXF-293C |
| Cycle
Time |
0.06s /dot (Movement distance
5mm), 0.08s /dot (Movement distance 10mm) |
| Dispensing
Accuracy |
±0.1mm |
| Board
Size |
L 50mm X W
50mm to L 330mm X W 250mm |
| Screen
Frame Size |
±180° (Setting
in units of 0.1 degrees) |
| Dissipation
Power |
Triple phase AC 200V ±
10V, 2.5kVa (main unit) |
| Air
Supply |
490kPa, 150l/min [Normal] |
| Dimensions |
L 1500mm X D 825mm X H
1600mm |
| Mass |
780kg |
*Value such as cycle time and
dispensing accuracy may vary depending on operational
conditions.
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