Printability, productivity and operativity have all been improved. It's a futher enhanced, new high-speed screen painting machine.
The Based on the comcept of being "easier to use", the functionality of the new SP28P-DH high-speed screen printer has been further improved by incorporating new functions designed to enhance the operativity of its predecessor, which had already established a reputation as being highly capable in the high-speed printing process. In addition to improved operativity, the SP28P-DH also boasts dramatic improvements in printing control and productivity. The newly adopted cartridge head [optional] has resulted in reduced change-over time and improved soldering yield, and permits the use of lead-free solder.

Capable of super fine-pitch bump printing
In addition to its proven high-speed printing capabilities, the SP28P-DH also incorporates a new stencil control system that is compatible with bump printing. This system achieves high-quality snap-off (free from stencil tension interference) by controlling the movement of the table during snap-off. the new control system realizes super fine-pitch bump printing.

Improvement of overall productivity
PCB transport time is shortened to 6 seconds by reassessing each action from PCB transport to PCB recognition.

Better operativity and faster change-over "easier to use" now a reality
The interactive change-over system eliminates operator performance deviations and errors. The adoption of support pin gang change-over [optional] has reduced conversion time and has greatly improved operativity. By making the previously optional Universal Stencil Holder into standard equipment, the machine is now capable of handling frames ranging from D size to M. The printing condition library has also been ezpanded from 18 types to 32.

The newly developed cartridge head extends solder life and also improves work efficiency
The new system features a sealed head with a solder cartridge in it. This head prints the solder while moving over the stencil. The sealed head extends solder printing life compared with the squeegee method, and reduces solder waste radically. This head can also handle lead-free solder, which is degrated easily. The cartridge method also realizes quick change-over.