5, 6, 8 inch
With single orientation flat or V notch
Thickness : Over 300 µm
Cassette
SEMI specs.
Chip
30mm x 30mm Max.
Inspection
Object
Solder bump on the wafer
Solder bump height, 10 ~ 130µm, pitch, over
150µm
Outline IS-100 is high-speed inspection
developed for area array bump inspection
Measuring Method:
Triangulation by laser scanning.
Inspection object: Solder
bump on the wafer.
Handling: Cassette to
cassette inspection.
Result output: Realtime
display per chip and also can be recorder on MO.
Features
High speed measurement
of the height for solder bumps with high accuracy
(±0.25µm @ aveó). Measuring
range from 10 ~ 130µm height.
High-speed inspection by AOD
(Acousto Optical Deflector), laser scanning, and
triangulation.
Input and processing height and brughtness informations
at 7 megapoint/sec.
Realtine display for inspection
results per chip.
Performance
Measuring
resolution
0.1µm
Inspection
speed
720,000 bumps/HR*
* Depend on bump distribution. Figure
obtained in actual measurement of area array bumps at 150µm
pitch on a 17mm2 chip.
Specifications
Dimensions
(W)1540mm X (D)960mm X (H)1390MM* *Excluding monitor, signal tower
and keyboard.
Weight
Approx. 800kgs
Electrical
100VAC 50/60Hz
20A
Air supply
5kgs/cm2
(Clean dry air)
Environmental
Temperature
20 to 27°c
Humidity 30 to 70% (non-condensation)
Inspection
stage
4 axis (XYZ)
automatic stage
Wafer handling
3 axis robot
with optical orifice adjustment unit
Display
17 inch PC monitor (for operation)
14 inch video monitor (for monitoring)
Output
device
FD drive (1.44
megabytes)
MO drive (230, 540, 640 megabytes)
Operation
system
Windows NT
Indicator
Signal tower
(green, red)
Others
SPC software
(option)
Laster operation warning indicator
Laster safety system
