home SMT-systems division Hitachi Solder Print Inspection System BPC-707

Hitachi: Solder Print Inspection System BPC-707

Features
Speed increased by a factor of 2 to 3
Data creation time cut by 50%
Improved silk screening removal function
Compatible with pad printing of various types (gold, copper, solder) and flexible circuit boards

Options
Off line programming software
Defective markings (stamp type)
Please contact us regarding circuit boards larger then medium size (330 mm X 250 mm)

Specifications
Board size M (330mmX250mm) Inspection Time 0.35 sec/area
(1million pixel camera) Note
(0.09 sec./area conventional 250,000 pixel camera)
Flow direction Left-to-right
or right-to-left		 Camera field of view Selectable from 10mm, (9.8µm/pixel) to
20mm, (19.6µm/pixel) range. Set at time of shipment
Fixed rail side Back or front Illumination Dome type LED illumination
Inspection Item missing, bleeding
shifting, bridging		 Inspection data programming Automatic conversion from Gerber Data Manual editing of graphic base
Min. pad size for
inspection		 ø90µm Utilities AC100V,±10% 1.5KVA(2-pole power cable with ground terminal 2.5m)
0.4~0.5Mpa 10NI/min (ø8 air supply hose)
Min. components
(actual data)		 0.15mm CSP
0.10mm 0603
ball pitch 0.15mm:CSP
Min. gap in btween
0.10mm:0603 chip		 Dimensions 1100(W) X780 (D) X1900(H) mm
(body height 1373mm)
Weight Approx. 350Kg

April 2000 Specification. The specification and illustration are subjected to change without notice due to product improvement, etc.
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