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Hitachi Solder Print Inspection System BPC-1000
Hitachi: Solder Print Inspection System BPC-1000
Options
Applicable to L-sized board (510 x 460)
Dimensions(LWH): 1590 x 1200 x 1900mm
Height measurement by laser Single-lens camera
Glossy pad illumination unit suitable for pre-solder printing board
Off line data programming software Windows 95/98 compatible
High resolution camera: 1.3 million pixels
NG marking suitable for multi-block board
Conveyor extension (by 35 to 150mm for incoming and outgoing) adjustable to the current conveyor length
We can also offer a flexible response to individual customer requirements.
Specifications
Board size
M (330mmX250mm)
L (510mmX460)
Inspection Time
0.24 sec/area/500pads
Flow direction
Left-to-right
or right-to-left
Camera field of view
Chpice of two lenses in the range 7mm, (13.7µm/p.e) to 22mm, (13.0µm/p.e)
(set at time of shipment)
Fixed rail side
Back or front
Illumination
Dome type LED illumination
Inspection Item
Blurring, bleeding
shifting, bridging
Inspection data programming
Automatic conversion from Gerber Data Manual Editing on Graphics pads data
Min. pad size for
inspection
130µm
Utilities
AC100V,±10% 1.5KVA
0.4~0.5Mpa 10NI/min
Min. components
(actual data)
0.25mm CSP
0.10mm 0603
ball pitch 0.25mm:CSP
Min. gap in btween
0.10mm:0603 chip
Dimensions
M: 1050(W) X800 (D) X2000(H) mm
L: 1575(W) X1200 (D) X2000(H) mm
(to the top of signal tower)
Weight
M: Approx. 350Kg
M: Approx. 500Kg
December 2001Specification. The specification and illustration are subjected to change without notice due to product improvement, etc.
